Analog Devices,TEXAS INSTRUMENTS,ROHM,MICROCHIP TECHNOLOGY,STMicroelectronics,UMW/友台半导体,Maxim Integrated,BROADCOM,MAXLINEAR,TOSHIBA,Renesas Electronics,ST MICROELECTRONICS,PERICOM SEMICONDUCTOR,onsemi,Maxim,New Japan Radio,COREBAI/北京芯佰微电子,Analog Devices/Linear Technology,Linear Technology,SGMICRO/北京圣邦微电子,IDCHIP/深圳英锐芯电子,Silicon Laboratories,Apex Microtechnology,MD/上海明达微电子,Texas Instruments Inc,Analog Devices Inc,Maxim(美信),Maxim Integrated Products Inc,HGSEMi/广东华冠半导体,Maglite,Microchip Technology Inc,DIODES,INFINEON TECHNOLOGIES,ON Semiconductor,Silergy/杭州矽力杰,INFINEON,Nisshinbo Micro Devices,MITSUMI ELECTRIC,MONOLITHIC POWER SYSTEMS,RENESAS ELECTRONICS AMERICA,ROHM Semiconductor,UTC/台湾友顺科技,DIODES INC.,SHOUDING,Microsemi,NXP(恩智浦),矽力杰silergy,THAT Corporation,NXP SEMICONDUCTORS,FM/深圳富满电子,BRIDGETEK,NXP Semiconductors (Philips),ST Micro Electronics,Heroic/嘉兴禾润电子,BroadcomLimited,Rochester Electronics,PHOENIX CONTACT,Skyworks Solutions,Semtech,Renesas(瑞萨),National Semiconductor,On Semiconductor/Fairchild,Mini-Circuits}

FH/广东风华高科,Cornell Dubilier Electronics,CORNELL DUBILIER,Murata Manufacturing,TDK,Nippon Chemi-Con,KEMET,RUBYCON,TAIYO YUDEN,Ymin/上海永铭电子,WURTH,Panasonic,nichicon,RS PRO,WALSIN/台湾华新科技,CORNELL DUBILIER - CDE,KYOCERA,Walsin Technology/台湾华新科技,EYANG/深圳宇阳科技,SAMSUNG,Vishay Intertechnology,LELON ELECTRONICS/台湾立隆电子,TORCH/福建火炬电子,AVX,AiSHi/湖南艾华集团,YAGEO/台湾国巨,Sunlord/深圳顺络电子,Kyocera AVX,KyoceraAVXComponents,Kyocera AVX Components,MurataManufacturingCoLtd,MACOM,SkyworksSolutionsInc,Skyworks,Skyworks Solutions,XIANGYEE,Xiangyee/湖南湘怡中元(湘江),ROHM,Amphenol,DALE (VISHAY),Vishay Semiconductors,YAGEO,KEMET Corporation,NTE,Kemet Electronics Corp,KNOWLES ELECTRONICS,TDK Corporation,VishayIntertechnologies,KnowlesCorporation,KEMETCorporation,LittelfuseInc,APITechnologiesCorp,NIC COMPONENTS CORP,YAGEO AMERICA,Vishay / Dale,Vishay Intertechnologies,Dale,CORNELL DUBILIER/MALLORY,KEMET ELECTRONICS,YAGEOCorporation,Nova,NISSEI,Wurth Elektronik,MURATA,TDKCorporation,Vishay,CornellDubilierElectronicsInc,SparkFunElectronics,WIMA,Cornell-Dubilier,OSEPP,Genteq,TUNGSRAM,PanasonicElectronicComponents,Chemi-Con,WURTH ELECTRONICS,Evox Rifa,VISHAY SPECIALTY CAPACITORS,EPCOS,PAKTRON/PANCON CORP.,PANASONIC INDUSTRIAL DEVICES,ILLINOIS CAPACITOR,EATON,ELNA,DUCATI Energia,CTS,EatonCorporation,TOKIN,UNITED CHEMICON INC.,EATON ELECTRONICS,SAMXON,KAMCAP/锦州凯美,VINATECH,Faratronic/厦门法拉电子,Xiamen Faratronic,KYOCERAAVX,EATON BUSSMANN,Maxwell Technologies,Knowles Johanson Manufacturing,Knowles Voltronics,CTS CORP,JOHANSON MANUFACTURING,Vishay Spectrol,Tusonix / CTS,Tusonix,TDK ELECTRONICS,CAPACITORES COMPONENTES,AdafruitIndustries,SURGE COMPONENTS,ESSENTRA / RICHCO,UnitedChemi-ConInc,Holy Stone/台湾禾伸堂,DERSONIC/东莞德尔创电子,BivarInc,KYET/东莞科雅电子,Murata Electronics,PSA/台湾信昌电陶,PSA(信昌电陶)}

Morningstar,PHOENIX CONTACT,Memory Protection Devices,COSEL,Panasonic,TE CONNECTIVITY,POWER-SONIC,PHIHONG,MEAN WELL,Keystone Electronics,ShinChin,Takachi Electric Industrial,TOREX SEMICONDUCTOR,Calex Manufacturing,RS PRO,BULGIN,ADAM TECHNOLOGIES, INC.,TEXAS INSTRUMENTS,TTElectronicsplc,PHOENIXCONTACT,ILLINOIS CAPACITOR,KEITHLEYINSTRUMENTS,ENERGIZER,Altech,nichicon,RENATA BATTERY,FLIR,SchneiderElectric,EXTECH,Iso-Tip,AmphenolCorporation,VARTA BATTERIES,TrippLite,RRCpowersolutions,Schneider Electric,TT Electronics,StarTech.com,KEYSTONE ELECTRONICS CORP,YENJI/台湾元基电子,molex,Amphenol,AltechCorporation,VARTA,ANSMANN,Renata,ADAM TECH,Hammond Mfg.,CONNFLY/宁波晨翔电子,Varta Microbattery,APC,Comfortable Electronic/台湾常利,Littelfuse,TADIRAN,Tadiran Batteries,Hartmann Codier,MEAN WELL/台湾明纬,TDK,MORNSUN/广州金升阳科技,Murata Manufacturing,BEL,NTE,Flex Power Modules,SHOGYO,TDKCorporation,VICOR,MEANWELL,Saft,Phaesun,MULTICOMP PRO,Bopla,CUI,PHILMORE MFG.,Memory Protection Dev.,Recom,Mode,BEL POWER SOLUTIONS,MORNSUN,POWER DYNAMICS,EaglePlasticDevices,TDK Lambda,SparkFunElectronics,OMRON,BELPOWERSOLUTIONS,CUIInc,LittelfuseInc,TECONNECTIVITY,AdafruitIndustries,DFRobot,PULS,Mascot,Aimtec,HUBBELL,Maxim Integrated,Duracell,KEYSTONE,Maxim,MikroElektronika,CSB BATTERY,Analog Devices/Linear Technology,COTEK,BRAD FROM MOLEX,SIEMENS,ZETTLER,Analog Devices,MURATA,DURACELL PROCELL,HARWIN,YUASA,IDEC,EA ELEKTRO-AUTOMATIK,TECMATE,OSRAM DS,ERP Power,multicomp,CUI INC,ALTECH CORPORATION,MURATA POWER SOLUTIONS,ULTRALiFE,PhihongUSA,Curtis Industries,Carlo Gavazzi,Legrand,Friwo,VIGORTRONIX,OSRAM,Ideal Power,Excelsys,EATON,Keysight,EOS,STMicroelectronics,XP POWER,LUMINUS,AUTEC POWER SYSTEMS,CinconElectronicsCorporation,Moons,SL Power Electronics,BRIDGELUX,TRIAD MAGNETICS,DeltaElectronicsInc,MOONS INDUSTRIES,RECOMPowerInc,JKLComponentsCorporation,Pi Supply,Sanyo,STECA,PANASONIC IND DEVICES (PIDSA),PanasonicElectronicComponents,ADAFRUIT INDUSTRIES,ORIUM,OSEPP,SeeedDevelopmentLtd,Sola/Hevi-Duty,RIELLO,HammondManufacturing,PanduitCorp,Altech Corp.,X-POWERS,ZETTLER MAGNETICS,RECOM POWER,Storacell,TDK-LAMBDA,Bel Fuse,ROHM,Power Integrations,TOREX,TRIPP LITE BY EATON,DELTA PRODUCTS,MurataManufacturingCoLtd,CUSTOM POWER DESIGN,B&K Precision,EnerSys Energy Products, Inc,CURTIS INSTRUMENTS,ETA-USA Power,EOS POWER,SCHROFF,CINCON ELECTRONICS,ETA-USA,InternationalPower,CoselUSAInc,AdvancedEnergyIndustriesInc,KeysightTechnologies,SILVERTEL,AstrodyneTDIPowerSupplies&EMIFilters,TDK-LAMBDACORPORATION,Endicott Research,AdvantechCoLtd,MonolithicPowerSystems,SEEED STUDIO,STANCOR,Vox Power,MYRRA,Artesyn Embedded Power,INVENTUS POWER,Digi International,HAMMOND MANUFACTURING,TAMURA,SOLA,NTE ELECTRONICS,TriadMagnetics,QualtekElectronicsCorporation,TERASIC,KAGA Electronics,MONOLITHIC POWER SYSTEMS,WAGO,Microchip Technology/Atmel/Micrel,Microchip Technology Inc,nVent,Vox Power Ltd,OMRON INDUSTRIAL,Crouzet Control,ArtesynEmbeddedTechnologies,PowerIntegrations,OMRONCorporation,AnalogDevicesInc,BELFUSE}

Greenwich Instruments,Maxim Integrated,SAMSUNG,Ramtron,Micron Technology,Maxim,INTEGRATED SILICON SOLUTION,GigaDevice/北京兆易创新,Alliance Memory,Adesto Technologies,winbond/台湾华邦,FUJITSU,intel,INFINEON TECHNOLOGIES,AllianceMemoryInc,MicronTechnologyInc,Renesas Electronics,Micron,Western Digital Corp,INFINEON,InfineonTechnologiesAG,CYPRESS,Microchip,Macronix,ISSI,IntegratedSiliconSolutionInc,MicrochipTechnologyInc,WINBOND ELECTRONICS,MICROCHIP TECHNOLOGY,ALLIANCE MEMORY, INC.,KINGSTON TECHNOLOGY COMPANY,Micron Technology Inc,INTEGRATED SILICON SOLUTION (ISSI),Analog Devices/Linear Technology,EverspinTechnologies,TEXAS INSTRUMENTS,ESMT(台湾晶豪),Everspin Technologies,Micron(美光),ISSI(美国芯成),onsemi,AnalogDevicesInc,Nanya Technology/台湾南亚科技,CypressSemiconductor,ADESTO,Cypress Semiconductor/Spansion,FUJITSU SEMICONDUCTOR,MACRONIX/台湾旺宏电子,Transcend,Microchip Technology/Atmel/Micrel,Winbond,RENESAS,Infineon Technologies/IR,Cypress Semiconductor,Gsi Technology,GsiTechnology,swissbit,Apacer Technology/台湾宇瞻科技,INSIGNIS TECHNOLOGY,E-TEC,STMicroelectronics,Rochester Electronics,Zetta/苏州澜智,JST,ST Micro Electronics,INTEGRATED DEVICE TECHNOLOGY,ST MICROELECTRONICS,CYPRESS - INFINEON TECHNOLOGIES,LYONTEK,Renesas Technology Corp,Intel/Altera,Xilinx Inc.,XILINX,AlteraCorporation,Atmel,ALTERA,ADVANCED MICRO DEVICES,Atmel Corp,Teledyne e2v,ROHM,NXP SEMICONDUCTORS,FMD/深圳辉芒微电子,HGSEMi/广东华冠半导体,MikroElektronika,ON Semiconductor,On Semiconductor/Fairchild,Microchip Technology Inc,NTE ELECTRONICS,MICROCHIP TECH.,FAIRCHILD,Catalyst,CATALYST SEMICONDUCTOR,Sanyo,Xicor,National Semiconductor,BELLING/上海贝岭,Maxim Integrated Products Inc,Future Technology Devices International,RenesasElectronicsCorporation,QUALITY SEMICONDUCTOR,LUMINARY MICRO,IDT,TexasInstruments,AverLogic,InnoDisk,Transcend Information/台湾创见资讯,Lexar,Verbatim,iStorage,ATP,Crucial,ADATA,Western Digital,SILICON MOTION,FLEXXON,StarTech.com,DELKIN DEVICES,SparkFun Electronics,TDKCorporation,AdvantechCoLtd,Virtium,WinbondElectronicsCorp,SMART,ATP Electronics/台湾华腾,MK/米客方德,NXPSemiconductors,TDK,SIEMENS,SAMSUNG SEMI,Panasonic,Carlo Gavazzi,SchneiderElectric,SanDiskCorporation,ATPElectronicsInc,iEiIntegrationCorporation,PHOENIXCONTACT,AdafruitIndustries,PARALLAXINC,KINGSTONTECHNOLOGYCOMPANY,SPANSION,ADATA TECHNOLOGY (USA) CO., LTD.,PANASONIC INDUSTRIAL DEVICES,Lenovo,Ramtron International,Infineon(英飞凌),HK/深圳航顺芯片,PHOENIX CONTACT,GIANTEC/上海聚辰半导体,i-CORE/无锡中微爱芯,ABLIC,PUYA/上海普冉半导体,ROHM Semiconductor,Slkor/萨科微,HXY MOSFET/深圳华轩阳电子,KINGSTON TECHNOLOGY,GreenliantSystemsLtd,JSMICRO/深圳杰盛微,TOSHIBA,SHIKUES/台湾时科,APEC/台湾富鼎先进,TWGMC/台湾迪嘉电子,WILLSEMI/上海韦尔半导体,CR Micro/无锡华润微电子,WINSOK SEMICONDUCTOR/台湾微硕半导体,TECH PUBLIC/台湾台舟电子,isc/无锡固电半导体,Sinopower Semiconductor/台湾大中,LGE/深圳鲁光电子,HOTTECH/广东合科泰,MSKSEMI/台湾美森科,HAOLIN/深圳豪林电子,UTC/台湾友顺科技,YANGJIE/扬州扬杰电子,Integral Memory,Raaco,ARK micro/成都方舟微电子,HUAYI/西安华羿微电子,KIA/深圳可易亚半导体,WAYON/上海维安电子,NIKO-SEM/台湾尼克森微,BORN/深圳伯恩半导体,HUASHUO/深圳华朔半导体,STANSON/深圳司坦森,Truesemi/信安半导体,YFW/东莞佑风微电子,Kingston,GOTOP/上海高通半导体,FOSAN/安徽富信半导体,LONTEN/西安龙腾半导体,Chino-Excel Technology/台湾华瑞科技,SINO-IC/上海光宇睿芯,ASDsemi/安森德半导体}

WURTH ELECTRONICS,TDK,KEMET,Wurth Elektronik,CHILISIN/台湾奇力新,SCHAFFNER,Vishay,TDK - TERIDIAN,ABRACON,Murata Manufacturing,BOURNS,sumida,BournsInc,PulseElectronicsCorporation,TDK Corporation,CND-tek/深圳磁联达电子,molex,Sunlord/深圳顺络电子,FH/广东风华高科,TDKCorporation,WurthElektronik,TAIYO YUDEN,EATON,PULSE ELECTRONICS,TOKIN,Chemi-Con,Sumida Electric,Coilank/深圳驰兴科技,Vishay Semiconductors,LairdPerformanceMaterial,WURTH,LAIRD,ABRACON LLC.,DELEVAN,TRIAD MAGNETICS,API Delevan,MURATA POWER SOLUTIONS,VishayIntertechnologies,RS PRO,TAMURA,SCHURTER,TXCCorporation,TE CONNECTIVITY,COILCRAFT,TT Electronics,EatonCorporation,Central Technologies,EPCOS,EATON ELECTRONICS,SIGMAINDUCTORS - TE CONNECTIVITY,CODACA/深圳科达嘉,FERROPERM,FASTRON,SXN/深圳顺翔诺电子,Vishay / Dale,Viking Tech/台湾光颉科技,Talema,Hammond Mfg.,COOPER Bussmann,Ferrocore,NIC Components,Sunlord,MULTICOMP PRO,Coiltronics / Eaton,Roxburgh EMC,DELTA Electronics/台湾台达,EATON COILTRONICS,Maxim,Pulse,EATON ELECTRONICS / BUSSMANN,HAMMOND MFG,SIGNAL TRANSFORMER,TE Connectivity / Sigma Inductors,ICEComponentsInc,FASTRONGmBH,TTElectronicsplc,APIDelevan,Abracon Corporation,MurataManufacturingCoLtd,HammondManufacturing,Fair-RiteProductsCorp,KEMETCorporation,AVX,Panasonic,ZETTLER MAGNETICS,NIC COMPONENTS CORP,PHOENIX CONTACT,EATON BUSSMANN,TDK ELECTRONICS,LEM,HONEYWELL,WAGO,iNRCORE,Allegro Microsystems, LLC,FC/方成电子,Nuvotem Talema,SIMPSON ELECTRIC,Carlo Gavazzi,SeeedDevelopmentLtd,AsahiKaseiMicrosystemsCorporation,TamuraCorporationofAmerica,VacuumschmelzeGmbH&CoKG,iNRCORELLC,LittelfuseInc,TriadMagnetics,HoneywellSensingandControl,CarloGavazziHoldingAG,INFINEON,SIEMENS,TDK-EPCOS,Sifam Tinsley,ALLEGRO MICROSYSTEMS,BROADCOM,OEP,HOP/北京霍远,Mini-Circuits,HXY MOSFET/深圳华轩阳电子,VIGORTRONIX,STANCOR,CALRAD ELECTRONICS,XiconPassiveComponents,NEUTRIK,HanRun/中山汉仁电子,HAMMOND,Block,Schneider Electric,HAHN,Carroll & Meynell,HAMMOND MANUFACTURING,MYRRA,Eaton Electrical,HALO ELECTRONICS,CherryIndustrialSolutions,SumidaCorporation,HaloElectronicsInc,BEL,MENTECH/东莞铭普光磁,ETAL,Bothhand Enterprise/台湾帛汉,BEL Stewart Connector,Pulse Electronics Corporation,LINK-PP/惠州连普,Renesas Electronics,Bel Group,Bel Fuse,YDS/上海元册科技,TE Connectivity / CoEv Magnetics Brand,SCHAFFNER EMC,Breve Tufvassons,DALE (VISHAY),Legrand,Altech,HARTING,DEXU/广州德旭,TAOGLAS,HAHN-ELEKTROBAU,SOLLATEK,ABB,FERROXCUBE,FAIR-RITE,LAIRD PERFORMANCE MATERIALS,LAIRD PLC,LAIRD / STEWARD,EPCOS / TDK,ESSENTRA,KEMET Corporation,TDK Lambda,PSA/台湾信昌电陶,TAI-TECH/台湾西北台庆,SGTE/深圳感通科技,cybermax/思博科技,MURATA,STACO ENERGY,FAIR-RITE PRODUCTS,Sola/Hevi-Duty,PHOENIXCONTACT,CJIANG/深圳长江微电,YJYCOIN/深圳益嘉源电子,microgate/深圳麦捷微电子,KOHERelec/上海科或,HARTINGTechnologyGroup,SparkFunElectronics,KyoceraAVXComponents,PHILMORE MFG.,--}

Monitran,Analog Devices,Assemtech,TEXAS INSTRUMENTS,Maxim Integrated,XKB Connectivity/中国星坤,ifm electronic,TE,TDK,Murata Manufacturing,MICROCHIP TECHNOLOGY,OMRON,Analog Devices/Linear Technology,STMicroelectronics,OncQue,ROBERT BOSCH,NXP SEMICONDUCTORS,UMW/友台半导体,Sensata Technologies,TE CONNECTIVITY,HAUBER ELEKTRONIK,ROHM,MURATA,Xsens,Heraeus,OMRON ELECTRONICS,AmphenolCorporation,AdafruitIndustries,SparkFunElectronics,ST MICROELECTRONICS,PANASONIC IND DEVICES (PIDSA),BOSCH SENSORTECH,TECONNECTIVITY,SKF,BOSCH SENSORTEC,kionix,C&K,TDK INVENSENSE,Infineon Technologies/IR,Amphenol,NXP,KEMET,Xsens by Movella,Panasonic,Vishay,TOKIN,MicrochipTechnologyInc,SpotSee,SEMITEC,AMS OSRAM,KnowlesCorporation,SeeedDevelopmentLtd,DFRobot,KEMETCorporation,Memsic Semiconductor,AnalogDevicesInc,RS PRO,HONEYWELL,Sick,MultiTech,PANASONIC INDUSTRIAL DEVICES,AMPHENOL ADVANCED SENSORS,LITTELFUSE, INC.,MELEXIS,InvenSense Inc,onsemi,NXP SEMICONDUCTOR,EPCOS,BC COMPONENTS (VISHAY),TDK Corporation,SENSORTEK/台湾昇佳,SENSATA CIRCUIT BREAKERS,Maxim,BOSCH,Analog Devices Inc,INVENSENSE,INFINEON,ZF Electronics Corp,PANASONIC EW/AROMAT,TDKCorporation,Aceinna,HoneywellSensingandControl,OncqueCorporation,MovellaTechnologiesBV,PanasonicElectronicComponents,BoschSensortec,MemsicInc,VishayIntertechnologies,ALPS ALPINE,ams,INFINEON TECHNOLOGIES,Alliance Sensors Group,Baumer,Gefran,Solartron Metrology,SENSATA / BEI SENSORS,Turck,Measurement Specialties,Hengstler,MagnTek/上海麦歌恩,BALLUFF,ZF Friedrichshafen,Micronas,BI Technologies / TT Electronics,grayhill,Vishay Intertechnology,EVERLIGHT/台湾亿光电子,OSRAM,InfineonTechnologiesAG,TOSHIBA,DIODES INC.,ALLEGRO MICROSYSTEMS,Amphenol Piher,Carlo Gavazzi,COTO Technology,Standex-Meder Electronics,CrossChip/成都芯进电子,Allegro Microsystems, LLC,Slkor/萨科微,Taiwan Semiconductor,Celduc,HX/无锡华芯科技,Altech,LEM,Diodes Incorporated,UTC/台湾友顺科技,Standex Electronics,SILICON LABS,AH/南京艾驰电子,QST/上海矽睿科技,MST/台湾美伽,AMPHENOL PIHER SENSORS AND CONTROLS,DIODES,Asahi Kasei Microdevices,DIODES(美台),Littelfuse,Festo,OMRON INDUSTRIAL AUTOMATION,STANDEXMEDER,Silicon Laboratories,DiodesZetex,Honeywell(霍尼韦尔),Red Lion,LITE-ON Technology/台湾光宝科技,Vishay Semiconductors,Renesas Electronics,TT Electronics,BROADCOM,EVERLIGHT,INOLUX,KINGBRIGHT COMPANY, LLC,VISHAY OPTO,IDEC,molex,Banner,Pepperl + Fuchs,Telemecanique Sensors,ISOCOM,Allen Bradley,SENBA/南阳森霸传感,ON Semiconductor,Autonics,Kingbright Electronic/台湾今台电子,New Japan Radio,Crocus Technology,PHOENIX CONTACT,Socomec,Nuvotem Talema,ABB,Efergy,WAGO,ALLEGRO,CUI DEVICES,MORNSUN/广州金升阳科技,XBLW/芯伯乐,Sifam Tinsley,HOBUT,Lovato,SIEMENS/西门子,Honeywell / MICRO SWITCH,CRANFORD CONTROLS,Werma,NVE,INGHAi/东莞赢海电子,Sensirion,Gems Sensors,SIEMENS,Asair/广州奥松电子,Flowline,SMC,SSt Sensing Limited,SGX Sensors,Georg Fischer,Xylem,Figaro,Vega,Simex,Parker,Key Instruments,FIGARO Engineering,cynergy3,Endress+Hauser,EC Sense,Gems,Digitron,DWYER,BROOKS,Delta-Mobrey,IST INNOVATIVE SENSOR TECHNOLOGY,Sensata / Cynergy3,MEDER ELECTRONIC,AdvancedThermalSolutionsInc,PotterElectricSignalCompanyLLC,CarloGavazziHoldingAG,OMRONCorporation,RenesasElectronicsCorporation,ATMI,Burkert,Rosemount,Parker UCC,JUMO,NOVOTECH CONTROLS,GIC,WIKA,SGX Sensortech,intel,Hamamatsu,On Semiconductor/Fairchild,BASLER AG,Lascar,DFROBOT/上海智位机器人,HARTINGTechnologyGroup,AMSOSRAMGROUP,ToshibaAmericaElectronicComponents,SensataTechnologies,KINGBRIGHT,Azoteq,Alpha Wire,OMNIVISION TECHNOLOGIES,Toshiba Semiconductor,BRAD FROM MOLEX,APTINA,BEI Sensors,AMS OSRAM GROUP,NKK Switches,PHOENIXCONTACT,ROHMSemiconductor,RENESAS,MARL,Avago Technologies/Broadcom Limited,AlphaWire,CROUZET,MEDER electronic (Standex),Silicon Microstructures,SENSIRION AG,All Sensors Corporation,Kavlico,Herga,SEEED STUDIO,Amphenol All Sensors,sencoch/无锡芯感智,SST Sensing,YAGEO/台湾国巨,Nidec Copal Electronics,KINGSTATE ELECTRONICS/台湾志丰电子,Interlink Electronics,BournsInc,BroadcomLimited,MEMSIC,SEMTECH CORPORATION,BOURNS,Mysentech/浙江敏源传感,Microchip,Banner Engineering,WURTH ELECTRONICS,ZILOG,CONEC Elektronische Bauelemente,United Automation,Hirschmann,Allen Bradley Guardmaster,BOSCH/博世}

FLUKE,SCHNEIDER/施耐德,Schneider Electric,PHOENIX CONTACT,施耐德电气,Merlin Gerin}