YAGEO,Murata Electronics,TAIYO YUDEN,Kyocera AVX,KEMET}

Analog Devices,INFINEON TECHNOLOGIES,TEXAS INSTRUMENTS,Maxim Integrated,NXP SEMICONDUCTORS,STMicroelectronics,ROHM,MICROCHIP TECHNOLOGY,onsemi,Nisshinbo Micro Devices,NXP SEMICONDUCTOR,MAXLINEAR,Infineon Technologies/IR,Microchip Technology Inc,Maxim,Microchip Technology/Atmel/Micrel,SIT/江苏芯力特电子,Linear Technology Corp,ST MICROELECTRONICS,Maxim Integrated Products Inc,Texas Instruments Inc,Maxim Integrated Product,UTC/台湾友顺科技,Rochester Electronics,Analog Devices/Linear Technology,Maxlinear,Inc./Exar/Sipex,Holt Integrated Circuits,Linear Technology,On Semiconductor/Fairchild,ASIX Electronics/台湾亚信电子,Union Semiconductor/上海英联电子,iNRCORE,3PEAK/苏州思瑞浦微电子,Skyworks Solutions Inc,ON Semiconductor,Maxim(美信),Semtech,National Semiconductor,Standard Microsystems,GENNUM,Renesas Electronics,RenesasElectronicsCorporation,EPSON,TOSHIBA,FAIRCHILD (ON SEMICONDUCTOR),FAIRCHILD,THINE ELECTRONICS,TI,Analog Devices Inc,TexasInstruments,AnalogDevicesInc,CHIPANALOG,XINLUDA/厦门信路达,ZLG/广州致远电子,PTC/台湾普诚科技,CHIPANALOG/上海川土微电子,NXP,Philips Semiconductors,MORNSUN/广州金升阳科技,ROBERT BOSCH,MICROCHIP(美国微芯),INFINEON,Intel/Altera,InfineonTechnologiesAG,NXPSemiconductors,MicrochipTechnologyInc,RENESAS ELECTRONICS AMERICA,PHOENIX CONTACT,MICREL SEMICONDUCTOR,SCHNEIDER/施耐德,RENESAS,Microchip,Diodes Incorporated,Crydom,MICROCHIP TECH.,AdvantechCoLtd,PHOENIXCONTACT,Industruino,IntelCorporation,ADVANCED MICRO DEVICES,Future Technology Devices International,DIODES(美台),WCH/南京沁恒微电子,FTDI,FTDI CHIP,MaxLinearInc,INTERSIL,SIPEX,Harris,Teledyne e2v,EXAR(艾科嘉),TI(德州仪器),Exar,CYPRESS,UMW/友台半导体,HXY MOSFET/深圳华轩阳电子,OPTO-22,COREBAI,COREBAI/北京芯佰微电子,BROADCOM,XBLW/芯伯乐,WIZNETCOLTD,MULTI-TECH SYSTEMS,Slkor/萨科微,BELLING/上海贝岭,HGSEMi/广东华冠半导体,HTC Korea,intel,瑞纳捷/Runjet,WinbondElectronicsCorp,New Japan Radio,Lattice Semiconductor,SGMICRO/北京圣邦微电子,StarTech.com,Cirrus Logic,ST(意法半导体),NUVOTON TECHNOLOGY/台湾新唐科技,REALTEK SEMICONDUCTOR/台湾瑞昱半导体,Dialog Semiconductor,PUI AUDIO,TempoSemiconductorInc,u-bloxAG,AsahiKaseiMicrosystemsCorporation,CirrusLogic,ROHMSemiconductor,Burr Brown,FREESCALE,Sanyo,ZARLINK,ADI(亚德诺),Semtech Corporation/Gennum,Vishay Semiconductors,DIODES,DiodesIncorporated,NEXPERIA,WIZNET,MARVELL,FINISAR,WIZnet Inc,Aquantia,Avago Technologies/Broadcom Limited,ST Micro Electronics,DAVICOM Semiconductor/台湾联杰,IC plus/台湾九旸电子}

Analog Devices,Renesas Electronics,NXP SEMICONDUCTORS,Analog Devices/Linear Technology,InfineonTechnologiesAG,Maxim,Maxim Integrated,TEXAS INSTRUMENTS,Linear Technology,ON Semiconductor,onsemi,Qorvo,Mini-Circuits,CMLMICROCIRCUITSPLC,TexasInstruments,NXPSemiconductors,Sanyo,AnalogDevicesInc,MACOM,BROADCOM,Skyworks Solutions,INFINEON,KeysightTechnologies,Skyworks,National Semiconductor,STMicroelectronics,Analog Devices Inc,INFINEON TECHNOLOGIES,Infineon Technologies/IR,ADI(亚德诺),RENESAS,INTERSIL,PowercastCorporation,Lantronix,TELEDYNE MICROWAVE SOLUTIONS,OMRON INDUSTRIAL,Maxim Integrated Product,ADI,GUERRILLARF,Hittite,AbraconCorporation,Nisshinbo Micro Devices,FAIRCHILD,FREESCALE,New Japan Radio,TECONNECTIVITY,CrystekCorporation,Atmel,Intel/Altera,Silicon Laboratories,Microchip Technology/Atmel/Micrel,LAIRDPLC,TWININDUSTRIES,Maxlinear,Inc./Exar/Sipex,Nisshinbo,RenesasElectronicsCorporation,APITechnologiesCorp,BroadcomLimited,AWINIC(艾为),Radiall,GC ELECTRONICS,TELEDYNE COAX,pSemi,Anadigics,ZARLINK,Broadcom Corporation,KnowlesCorporation,AnarenMicrowave,Maxim Integrated Products Inc,TeledyneRelays,SkyworksSolutionsInc,HONEYWELL,Teledyne Technologies,Susumu,Keysight Technologies,Teledyne,CYPRESS - INFINEON TECHNOLOGIES,LAIRD PERFORMANCE MATERIALS,Panasonic,CaliforniaEasternLaboratories(CEL),SV Microwave,HUBER+SUHNER,MicrochipTechnologyInc,molex,Amphenol / SV Microwave,Amphenol,LAIRD,FAIRVIEW MICROWAVE,AIM-Cambridge / Cinch Connectivity Solutions,OhmiteMfgCo,CinchConnectivitySolutions,AmphenolCorporation,WalsinTechnologyCorporation,LeaderTech,PanasonicElectronicComponents,CALTESTELECTRONICS,LairdPerformanceMaterial,Rosenberger,WurthElektronik,HIROSE ELECTRIC,PANASONIC INDUSTRIAL DEVICES,Amphenol SV Microwave,Wurth Elektronik,HiroseElectricCoLtd,PomonaElectronics,Murata Manufacturing,AVX,TTM TECHNOLOGIES,KyoceraAVXComponents,TDKCorporation,TAIYOYUDEN,KYOCERA,TDK,PULSE ELECTRONICS,JOHANSON DIELECTRICS,YANTEL/深圳研通,DiTomMicrowaveInc,TAIYO YUDEN,TDK - TERIDIAN,Semtech,YAGEO/台湾国巨,WALSIN/台湾华新科技,SeeedDevelopmentLtd,TDK Corporation,MurataManufacturingCoLtd,MOTOROLA,CTSCorporation,TAOGLASANTENNASOLUTIONS,PulseElectronicsCorporation,Linear Technology Corp,RFMi,Tai-Saw Technology/台湾嘉硕科技,Sunlord/深圳顺络电子,JOHANSON TECHNOLOGY,SEMTECHCORPORATION,RF SOLUTIONS,Knowles Dielectric Labs,ST MICROELECTRONICS,iNRCORELLC,COILCRAFT,L-com,Masach Tech,Avnet Engineering Services,WURTH ELECTRONICS,ROHM,SILEX TECHNOLOGY,MULTI-TECH SYSTEMS,RAYTAC,LAIRD PLC,Pulse,TE Connectivity / Kemtron,ESPRESSIF/上海乐鑫科技,CypressSemiconductor,MICROCHIP(美国微芯),SGMICRO/北京圣邦微电子,ams,AdvantechCoLtd,HanRun/中山汉仁电子,Digi International,ABRACON,XKB Connectivity/中国星坤,DreamLNK/深圳骏晔科技,BAT WIRELESS/深圳蝙蝠无线,Kinghelm/深圳金航标电子,RS PRO,Eccel Technology Ltd,FAIR-RITE,TE CONNECTIVITY,HOLTEK/台湾合泰半导体,MURATA,SILICON LABS,BULGIN,SIERRA WIRELESS,EnOcean,IDEC,HARTING,IMPINJ,HARWIN,LAIRD EXTERNAL ANTENNAS,SparkFunElectronics,CAL TEST ELECTRONICS,Amphenol RF,NORDIC SEMICONDUCTOR,PHOENIX CONTACT,MultiTech,Murata Electronics,HIROSE(HRS),KEMET,SUNWAY,Cypress Semiconductor,REALTEK SEMICONDUCTOR/台湾瑞昱半导体,Arduino,MICROCHIP TECHNOLOGY,Kyocera AVX,KAGA FEI,TOSHIBA,EMBEDDED ARTISTS,NXP SEMICONDUCTOR,LAIRD CONNECTIVITY,MEAN WELL,M5Stack,TE Connectivity / AMP Brand,Dialog Semiconductor,Cypress Semiconductor/Spansion,ZF Electronics Corp,NTE ELECTRONICS,PCTEL,INVENTEK SYSTEMS,TRIPP LITE BY EATON,MICROCHIP TECH.,Microchip,u-bloxAG,TAOGLAS,PULSE LARSEN ANTENNAS,QuectelWirelessSolutionsCoLtd,ANTENOVA,On Semiconductor/Fairchild,FANSTEL,Particle,YAGEO,Olimex,NXP,SensiEDGE,AdafruitIndustries,NORDICSEMICONDUCTOR,SILICONLABORATORIESINC,InsightSiP,AntenovaM2M,NIC COMPONENTS CORP,ABRACON LLC.,CALIFORNIA EASTERN LABORATORIES,SEMTECH CORPORATION,TE CNTY AMP,Jorjin Technologies,HOPERF/深圳华普微电,UDOO,WAGO,HOPERF,SIRETTA,LPRS,Linx,Ezurio,NATIONZ/深圳国民技术,WIZNET,Microchip Technology Inc,INSIGHT SIP,Semtech Corporation/Gennum,Kyocera AVX Components,NIC Components,MikroElektronika,ADAFRUIT,RALTRON,COMPEX SYSTEMS,MELEXIS,OMRONCorporation,TEXAS INSTRUMENT,HARTINGTechnologyGroup,ScioSense,PARALLAXINC,AMPLEON,Telemecanique Sensors,SpotSee,OMRON,ST(意法半导体),Renesas(瑞萨),SparkFun Electronics,SkyeTek,Silicon Image,Renesas Electronics Corporation,TP-LINK,Endress+Hauser,Avago Technologies/Broadcom Limited,DFRobot,Amphenol Procom,Mobilemark,2J Antenna,CTi,SIEMENS,Moxa,Advantech/台湾研华科技,SR PASSIVES,OKDO,API TECHNOLOGIES,ANAREN,SIRETTA LTD,TE Connectivity / Linx Technologies,3M,Sony,Keysight,UNICTRON TECHNOLOGIES/台湾咏业科技,DigilentInc,PHOENIXCONTACT,Ignion,ESPRESSIFINC,SEEED STUDIO,Xinabox,DFROBOT/上海智位机器人,SEEED TECHNOLOGY,NewAETechnologyInc,Icofchina/杭州中科微,TI(德州仪器)}

TEXAS INSTRUMENTS,NEXPERIA,ON Semiconductor,TOSHIBA,onsemi,TexasInstruments,STMicroelectronics,NXP SEMICONDUCTORS,Rochester Electronics,Texas Instruments Inc,UTC/台湾友顺科技,Toshiba Semiconductor,Teledyne e2v,Microchip,TI(德州仪器),INTEGRATED DEVICE TECHNOLOGY,Renesas Electronics,RENESAS,ST MICROELECTRONICS,MOTOROLA,CISSOID,National Semiconductor,UMW/深圳友台半导体,Harris Semiconductor,On Semiconductor/Fairchild,Slkor/萨科微,SGMICRO/北京圣邦微电子,ST Micro Electronics,Philips Semiconductors,TI,HGSEMi/广东华冠半导体,Fairchild Semiconductor Corp,Diodes Incorporated,NXPSemiconductors,i-CORE/无锡中微爱芯,ToshibaAmericaElectronicComponents,DIODES INC.,FAIRCHILD,QUALITY SEMICONDUCTOR,Harris,MICREL,Analog Devices,FAIRCHILD (ON SEMICONDUCTOR),ADVANCED MICRO DEVICES,UMW/友台半导体,Toshiba America Electronic Components, Inc.,MICROCHIP TECHNOLOGY,GN/上海旌芯半导体,HTC Korea,DIODES,XINLUDA/厦门信路达,HXY MOSFET/深圳华轩阳电子,Microchip Technology/Atmel/Micrel,FM/深圳富满电子,Nexperia(安世),DIODES(美台),NTE ELECTRONICS,MICROCHIP TECH.,Diodes Inc,Maxim,TECH PUBLIC/台湾台舟电子,Linear Technology,Nexperia USA Inc.,HOLTEK/台湾合泰半导体,ALPS ALPINE,NEXPERIA/NXP/FREESCALE,BroadcomLimited,BOURNS,Knitter-Switch,PANASONIC INDUSTRIAL DEVICES,BI TECHNOLOGIES,REALTEK SEMICONDUCTOR,PERICOM SEMICONDUCTOR,SUNGMUN ELECTRONICS,TE CONNECTIVITY,BROADCOM,Sensata Technologies,REALTEK SEMICONDUCTOR/台湾瑞昱半导体,grayhill,Maxim Integrated Product,NUVOTON TECHNOLOGY/台湾新唐科技,Cirrus Logic,Analog Devices/Linear Technology,Elma Electronic,Maxim Integrated,EG/深圳屹晶微电子,Everest-semi/苏州顺芯半导体,Maxim Integrated Products Inc,Nisshinbo Micro Devices,ROHM,SILICONIX (VISHAY),Analog Devices Inc,NEXPERIA SEMICONDUCTORS,Vishay,Vishay Semiconductors,Anadigics,INFINEON}

TE CONNECTIVITY,JST,SAMTEC,molex,Wieland Electric,OMRON,HARTING,Amphenol,ERNI Electronics,HARWIN,JAPAN AVIATION ELECTRONICS,HIROSE ELECTRIC,CamdenBoss,3M,Corsair Electrical Connectors,Conesys,GlenairInc,TECONNECTIVITY,AmphenolCorporation,TRI-STARELECTRONICSINTERNATIONAL,Amphenol LTW Technology,SOURIAU-SUNBANK,Amphenol Aerospace,Glenair Inc,Amphenol Industrial Operations,Amphenol Fiber Systems International,AMPHENOL FCI BERG,Japan Aviation Electronics Industry,AMPHENOL SINE SYSTEMS INC.,NORCOMP,AMPHENOL FCI,Conec Corporation,TE CNTY AMP,ITT Interconnect Solutions,JAE Electronics,Molex / FCT,CONEC Elektronische Bauelemente,ITT,PHOENIX CONTACT,C&K,Positronic,Aero-Electric Connector Inc,BULGIN,3M Interconnect,Amphenol Corporation,Cinch,Kinghelm/深圳金航标电子,Switchcraft,GLENAIR,MH Connectors,CLIFF ELECTRONIC COMPONENTS,Encitech Connectors,CLIFF Electronic,ITT CANNON,AMPHENOL COMMERCIAL PRODUCTS,KYCON,TE Connectivity / AMP Brand,Assmann WSW Components,Amphenol IO,TRIPP LITE BY EATON,SPECTRUM CONTROL,KyconInc,CWINDUSTRIES,APITechnologiesCorp,AdafruitIndustries,Kobiconn,HARTINGTechnologyGroup,Cinch Connector Div.,FCT FROM MOLEX,LONTIUM/合肥龙迅半导体,CONNFLY/宁波晨翔电子,KYCON CABLE & CONNECTOR INC.,BEL,SAMTECINC,PulseElectronicsCorporation,ASSMANN ELECTRONICS,ADAM TECHNOLOGIES, INC.,CommScope Inc,Adam Technologies Inc,Bel Fuse,ADAM TECH,HanRun/中山汉仁电子,PANDUIT,TE,HCTL/深圳华灿天禄,ON-SHORE TECHNOLOGY,PULSE ELECTRONICS,multicomp,ASSMANN WSW COMPONENTS GMBH,Lumberg,NEUTRIK,FUJITSU COMPONENTS,GC ELECTRONICS,Commscope,MOLEX / WALDOM,STEWART CONNECTORS,BELDEN,AMPHENOL ICC / FCI,EDAC,YamaichiElectronicsCoLtd,KyoceraAVXComponents,AirBornInc,NeutrikUSAInc,CinchConnectivitySolutions,BeldenInc,Amphenol LTW,BELFUSE,WINCHESTER INTERCONNECT CORP,AMPHENOL CANADA CORP,BEL Stewart Connector,Weipu Connector,LEMO,Aero-Electric Connector,HAMMOND MANUFACTURING,XKB Connectivity/中国星坤,ILME,Tri-Star,JS/深圳钜硕电子,WURTH ELECTRONICS,J.S.T. MFG,KYOCERA,Iriso Electronic,I-PEX,PANASONIC IND DEVICES (PIDSA),AVX,GLOBAL CONNECTOR TECHNOLOGY,JST CORPORATION,HIROSE,JST Manufacturing,XFCN/台湾兴飞连接器,HR,JS,Amphenol Communications Solutions(Amphenol FCI/Amphenol TCS),EDAC INC,SULLINS,Sullins Connector Solutions,Attend Technolog/台湾立威科技,SOFNG/台湾硕方电子,Vishay Semiconductors,SAMTEC INCORPORATED,AMPHENOL CANADA,BM GROUP,Altech,APTIV,Altech Corp.,OSTERRATH,Vogt AG Verbindungstechnik,IMP/香港日银,Kyocera AVX,TE Connectivity / P&B Brand,3M ELECTRICAL SPEC.,TE Connectivity / Raychem Brand,3MInterconnect,AltechCorporation,Heyco,WurthElektronik,SchneiderElectric,DanielsManufacturingCorporation(DMC),Schneider Electric,ALTECH CORP,CORNINGCABLESYSTEMS,Tyco/Amp,Radiall,Rosenberger,MurataManufacturingCoLtd,Amphenol SV Microwave,Amphenol RF,Cinch Connectivity Solutions,Trompeter,Amphenol Times Microwave Systems,HARTING Technology Group,Kings Electronics,POMONA,CINCH CONNECTIVITY SOLUTIO,TE Connectivity / AMP,NTE,RS PRO,HUBER+SUHNER,Amphenol / SV Microwave,MULTICOMP PRO,JOHNSON - CINCH CONNECTIVITY,TROMPETER - CINCH CONNECTIVITY,BROADCOM,WURTH,ABRACON,TRP Connector,Pulse,WEIDMULLER,BEL MAGNETIC SOLUTIONS,AMPHENOL FIBER SYSTEMS,Wurth Elektronik,Amphenol Socapex,TAOGLASANTENNASOLUTIONS,AbraconCorporation,EDACInc,Multi-Contact,WAGO,Staubli,METZ CONNECT,DALE (VISHAY),TE CNTY RAYCHEM,SUMITOMO,MOLEX/莫仕,SCHAFFNER,SCHURTER,ITTInterconnectSolutions,Delta Group,QUALTEK ELECTRONICS CORP,HUBBELL CONNECTORS,POWER DYNAMICS,Qualtek Electronics Corporation,TE CNTY CORCOM,Marinco,HUBBELL,HARTING ELECTRONICS,Amphenol Sine Systems,PHOENIX}

Lattice Semiconductor,intel,XILINX,MicrochipTechnologyInc,AMD,MICROCHIP TECHNOLOGY,Microchip,Intel/Altera,Xilinx Inc.,Diodes Incorporated,PHOENIX CONTACT,Microchip Technology/Atmel/Micrel,Cypress Semiconductor/Spansion,Rochester Electronics,RENESAS,LatticeSemiconductorCorporation,Teledyne e2v,Lattice,STMicroelectronics,TEXAS INSTRUMENTS,ADVANCED MICRO DEVICES,AMD XILINX,LATTICE SEMI,MICROCHIP TECH.,RenesasElectronicsCorporation,AlteraCorporation,NEXPERIA/NXP/FREESCALE,Cypress Semiconductor,NXP SEMICONDUCTORS,INFINEON,NXP,Renesas Electronics,INFINEON TECHNOLOGIES,ZILOG,ST MICROELECTRONICS,NXP SEMICONDUCTOR,Microchip Technology Inc,Anlogic/安路科技,Infineon Technologies/IR,SILICON LABS,Renesas Technology Corp,Microsemi}

UMW/友台半导体,EVERLIGHT/台湾亿光电子,TOSHIBA,Renesas Electronics,BROADCOM,LITE-ON Technology/台湾光宝科技,UMW/深圳友台半导体,Isocom Components,TEXAS INSTRUMENTS,Vishay Intertechnology,BroadcomLimited,Vishay,WURTH ELECTRONICS,ISOCOM,LITE-ON,RENESAS,VISHAY OPTO,EVERLIGHT INTERNATIONAL CORP.,FAIRCHILD (ON SEMICONDUCTOR),Toshiba Semiconductor,Toshiba America Electronic Components, Inc.,CT Micro/台湾兆龙,CJ/江苏长晶(长电),Avago Technologies,Skyworks Solutions,OMRON,Vishay Semiconductors,Orient/深圳奥伦德科技,COSMO Electronics/台湾冠西电子,ktp/科泰普,HXY MOSFET/深圳华轩阳电子,Toshiba Electronics,onsemi,On Semiconductor/Fairchild,Avago Technologies/Broadcom Limited,ON Semiconductor,Fairchild Semiconductor,Fairchild Semiconductor Corp,Slkor/萨科微,OCIC/深圳卓睿研发,AVAGO,FAIRCHILD,SHARP,TT Electronics,Wurth Elektronik,Vishay Semiconductor,Broadcom Corporation,OSI Optoelectronics,ams,Intelligent LED Solutions,AMS OSRAM,Centronic,Hamamatsu Photonics,Hamamatsu,OPTEK TECHNOLOGY,TTElectronicsplc,AMSOSRAMGROUP,IXYS,EVERLIGHT(台湾亿光),OSRAM,TE CONNECTIVITY,KINGBRIGHT,Vishay Dale,PanasonicElectronicComponents,EXCELITAS,Excelitas Technologies,Nisshinbo,First Sensor,SparkFunElectronics,ROHM,LASER COMPONENTS,Optek / TT Electronics,AdafruitIndustries,AMS OSRAM GROUP,Lite-OnSemiconductorCorporation,JKL COMPONENTS,HONEYWELL,Panasonic,OPTEK,ROHMSemiconductor,Kodenshi,SHARP(夏普),Kingbright Electronic/台湾今台电子,Bright Led Electronics/台湾佰鸿工业,WurthElektronik,OMRON INDUSTRIAL,LUMEX,GK/江苏固得沃克,NATIONSTAR/佛山国星光电,CR Micro/无锡华润微电子,Osram Opto Semiconductors,SunLED,NTE ELECTRONICS,VishayIntertechnologies,Stanley Electric,SharpMicroelectronicsoftheAmericas,HoneywellSensingandControl,ITWLumex,KAGA FEI,INFINEON TECHNOLOGIES,NXP SEMICONDUCTOR,MURATA,PARA Light Electronics/台湾光鼎电子,molex,Red Lion,MEIHUA/连云港美华电子,ROHM Semiconductor,Lantronix,Aim-TTi,Maxim,OBSERVER TOOLS,LEDLENSER,COAST,PETZL,Werma,Seoul Viosys,NIGHTSEARCHER,SIEMENS,Maglite,WOLF SAFETY,ANSMANN,LITE-ON ELECTRONICS,Amphenol,RS PRO,StarTech.com,UNILITE,VISHAY(威世),Analog Devices/Linear Technology,TE Connectivity / AMP Brand,COHERENTINC,LUMILEDS,ESPRESSIFINC,INOLUX,MARKTECH OPTOELECTRONICS,EatonCorporation,ATOP,PHOENIXCONTACT,BivarInc,SILICONLABORATORIESINC,AnalogDevicesInc,Hirschmann,Coherent,NXP SEMICONDUCTORS,CALIFORNIA EASTERN LABORATORIES,EMBEDDED ARTISTS,KINGBRIGHT COMPANY, LLC,ABB,Southco,SEEED/深圳矽递科技,WAGO,NICHIA,Vishay Intertechnologies,Moxa,LUMINUS,PHOENIX CONTACT,Microchip Technology/Atmel/Micrel,SILICON LABS,BRENNENSTUHL,American Bright Optoelectronics,HARTINGTechnologyGroup,HirschmannElectronicsGmbH&CoKg,CinchConnectivitySolutions,StanleyElectricCo,HIROSE ELECTRIC,QT-Brightek,CREE,BIVAR,Dialight,CML Innovative Technologies,WURTH,EVERLIGHT,Cree LED,SEOULSEMICONDUCTOR,CREE,INC.,LEDIL,Sanken Electric,IDEC,BULGIN,SEIWA ELECTRIC MFG,BRIDGELUX,SAMSUNG LED,SEOUL SEMICONDUCTOR CO., LTD,CARCLO OPTICS,SEOUL VIOSYS CO. LTD,Keystone Electronics,VISUAL COMMUNICATIONS CO,SCHURTER}

EVERLIGHT/台湾亿光电子,UMW/友台半导体,TOSHIBA,BROADCOM,Renesas Electronics,LITE-ON Technology/台湾光宝科技,UMW/深圳友台半导体,Isocom Components,TEXAS INSTRUMENTS,BroadcomLimited,Vishay,Vishay Intertechnology,VishayIntertechnologies,WURTH ELECTRONICS,LITE-ON,ISOCOM,VISHAY OPTO,RENESAS,FAIRCHILD (ON SEMICONDUCTOR),EVERLIGHT INTERNATIONAL CORP.,Toshiba Semiconductor,ktp/科泰普,CJ/江苏长晶(长电),Vishay Semiconductor,Skyworks Solutions,Avago Technologies,OMRON,WAGO,Vishay Semiconductors,Panasonic,Orient/深圳奥伦德科技,HXY MOSFET/深圳华轩阳电子,CT Micro/台湾兆龙,SHARP,Toshiba America Electronic Components, Inc.,COSMO Electronics/台湾冠西电子,Toshiba Electronics,OCIC/深圳卓睿研发,Micropac Industries,On Semiconductor/Fairchild,onsemi,Slkor/萨科微,Avago Technologies/Broadcom Limited,ON Semiconductor,Fairchild Semiconductor,TOSHIBA(东芝),KINGBRIGHT,Wurth Elektronik,BROADCOM (AVAGO),FAIRCHILD,Broadcom Corporation,ON Semiconductor (Farchild),OSI Optoelectronics,ams,Intelligent LED Solutions,Hamamatsu Photonics,AMS OSRAM,Hamamatsu,Centronic,TT Electronics,OPTEK TECHNOLOGY,TTElectronicsplc,AMSOSRAMGROUP,IXYS,EVERLIGHT(台湾亿光),OSRAM,TE CONNECTIVITY,AnalogDevicesInc,Vishay Dale,PanasonicElectronicComponents,EXCELITAS,Excelitas Technologies,Nisshinbo,First Sensor,ROHM,LASER COMPONENTS,Optek / TT Electronics,AdafruitIndustries,AMS OSRAM GROUP,Lite-OnSemiconductorCorporation,JKL COMPONENTS,HONEYWELL,OPTEK,ROHMSemiconductor,ROHM Semiconductor,SHARP(夏普),Bright Led Electronics/台湾佰鸿工业,Kingbright Electronic/台湾今台电子,WurthElektronik,OMRON INDUSTRIAL,LUMEX,CR Micro/无锡华润微电子,GK/江苏固得沃克,NATIONSTAR/佛山国星光电,Osram Opto Semiconductors,SunLED,NTE ELECTRONICS,Stanley Electric,SharpMicroelectronicsoftheAmericas,Kodenshi,HoneywellSensingandControl,ITWLumex,INFINEON TECHNOLOGIES,KAGA FEI,NXP SEMICONDUCTOR,MURATA,Amphenol,Red Lion,MEIHUA/连云港美华电子,PARA Light Electronics/台湾光鼎电子,Maxim,molex,Lantronix,Aim-TTi,OBSERVER TOOLS,LEDLENSER,COAST,PETZL,Werma,Seoul Viosys,NIGHTSEARCHER,StarTech.com,ANSMANN,SILICON LABS,Maglite,LITE-ON ELECTRONICS,Analog Devices/Linear Technology,VISHAY(威世),TE Connectivity / AMP Brand,ESPRESSIFINC,EatonCorporation,COHERENTINC,AmphenolCorporation,ATOP,INOLUX,BivarInc,SILICONLABORATORIESINC,AVAGO,RS PRO,Hirschmann,LUMILEDS,Coherent,NXP SEMICONDUCTORS,EMBEDDED ARTISTS,CALIFORNIA EASTERN LABORATORIES,KINGBRIGHT COMPANY, LLC,Southco,SEEED/深圳矽递科技,NICHIA,WOLF SAFETY,BRENNENSTUHL,ABB,Vishay Intertechnologies,Moxa,Microchip Technology/Atmel/Micrel,LUMINUS,PHOENIX CONTACT,American Bright Optoelectronics,CinchConnectivitySolutions,StanleyElectricCo,HirschmannElectronicsGmbH&CoKg,HARTINGTechnologyGroup,PHOENIXCONTACT,FINISAR,APPLIED MICRO CIRCUITS,HIROSE ELECTRIC,QT-Brightek,CREE,BIVAR,Dialight,CML Innovative Technologies,WURTH,EVERLIGHT,Cree LED,LEDIL,SEOULSEMICONDUCTOR,CREE,INC.,Sanken Electric,SEIWA ELECTRIC MFG,BULGIN,IDEC,BRIDGELUX,SEOUL SEMICONDUCTOR CO., LTD,SAMSUNG LED,CARCLO OPTICS,SCHURTER,VISUAL COMMUNICATIONS CO,Keystone Electronics,LUMINUS DEVICES INC.,CITIZEN,Amphenol LTW Technology,NIDEC COMPONENTS,SEEED STUDIO,OSRAM DS,Display Elektronik,NTE,Everlight Electronics,DISPLAY VISIONS,XINGLIGHT/深圳成兴光,EKINGLUX/东莞亿晶源光电,Apem,SAMSUNG,Telefunken Microelectronics GMBH,SEOUL Semiconductor,Samsung Semiconductor,Taunuslicht,OptoSupply/香港光谷,MARL,POWERTIP TECHNOLOGY,SGMICRO/北京圣邦微电子,Luckylight Electronics/香港佳光电子,MACROBLOCK/台湾聚积科技,EAO,Sloan,SIGNAL CONSTRUCT,PowerLED,Altech,RAFI,Displaytech}

MORNSUN/广州金升阳科技,iRdopto/深圳艾锐达光电,MORNSUN,KINGSTON TECHNOLOGY COMPANY,PHOENIXCONTACT,Schneider Electric,BIWIN/深圳佰维科技,USR IOT/ 济南有人物联网,ZDAUTO/中山智达,PHOENIX CONTACT,Lexar,YTY UNiCORE/苏州一天圆,winchen/深圳威勤,SIGNAL TECH/盛格科技,BIOSEC/上海图正,CGEC/上海陈工科技,ZLG/广州致远电子,Western Digital,Seagate,Hoodisk/深圳富迪微,Taisko/台湾台思科,SCHNEIDER/施耐德,施耐德电气,PERSMAN Precision Electronics,Kingston,ON Semiconductor,longsys/深圳江波龙电子,LONGSYS,KINGSTON TECHNOLOGY,WAVESHARE/深圳微雪电子,SK hynix,Bothhand Enterprise/台湾帛汉,TEXAS INSTRUMENTS,KINGSTONTECHNOLOGYCOMPANY,Lantronix,INFINEON TECHNOLOGIES,Yanzhi/杭州研智,lingqikj/西安零启,SchneiderElectric,ADATA Technology/台湾威刚科技,SCHNEIDER ELECTRIC/LEGACY RELAY,SQUARE D BY SCHNEIDER ELECTRIC,Celduc,WESTERN DIGITAL DEUTSCHLAND,SANDISK,KIOXIA,VICOR,Neumem/合肥中科智存,XTX/深圳芯天下,HYNIX SEMICONDUCTOR,Hynix,hozonovo/深圳浩汛,micradar/云帆瑞达,EC Sense,weishidak/深圳纬视达科技,WINSEN/郑州炜盛电子,Pycom,AI-THINKER/深圳安信可科技,YONCHAU/上海涌舟,Nemoto,ZHONGXU/南京中旭,PHISON/台湾群联,vaun/深圳微恩科技,Hi-Link/深圳海凌科电子,NiceRF/深圳思为无线,SEEED/深圳矽递科技,Seeed Studio/深圳矽递科技,zennze/正申科技,wisevision/江西芯智景,SeeedDevelopmentLtd,ZTRH/深圳正通仁禾科技,fengniaoRF/深圳蜂鸟无线}

WEIDMULLER,WIHA TOOLS,WAGO,Staubli,Daniels Manufacturing Corporation (DMC),TE CONNECTIVITY,molex,Gedore,WERE-CHERN/台湾维丞,GREATWALL/长城精工,宝工,PB Swiss Tools,Facom,STAHLWILLE,Bahco,SAM,ITL Insulated Tools Ltd,Dormer,RS PRO,Ega-Master,Teng Tools,Irwin,CK,STANLEY,Expert by Facom,Legrand,Eclipse,BOSCH,Bel-Stewart,Thomas & Betts,EVENTUS,WILLIAM WHITELEY & SONS,GearWrench,Bessey,Wera,SKF,Vikan,JST,Miller,DeWALT,Stanley FatMax,Makita,Weller,SES Sterling,BOSCH REXROTH,GMC-I Prosys,Pressmaster,MARTOR,ST MICROELECTRONICS,Sensirion,ROBERT BOSCH,AMS OSRAM,Xsens by Movella,Maxim Integrated,Figaro,Wurth Elektronik,Analog Devices/Linear Technology,DFROBOT/上海智位机器人,InfineonTechnologiesAG,SEEED STUDIO,THE THINGS INDUSTRIES,Laiier,FREESCALE,KEMET,STMicroelectronics,INFINEON,JORJIN,BOSCH SENSORTECH,MikroElektronika,SGX Sensors,Intelligent LED Solutions,Monk Makes,BARE CONDUCTIVE,Infineon Technologies/IR,WurthElektronik,PIPER,BOSCH SENSORTEC,Hamamatsu Photonics,Panasonic,INVENSENSE,RenesasElectronicsCorporation,Renesas Electronics,DFRobot,OKDO,INFINEON TECHNOLOGIES,ams,MicrochipTechnologyInc,Semtech,Microchip,Ezurio,Sunhayato,WURTH ELECTRONICS,RICHCO,3M,ESSENTRA COMPONENTS,CIF,UVOX,HARWIN,ESSENTRA,FORTEX,Vero Technologies,TWIN INDUSTRIES,Keystone Electronics,COTTAM,KITRONIK,ELDITEST,ROTH ELEKTRONIK,BUD,FISCHER ELEKTRONIK,3M INTERCONNECT SOLUTIONS,3M ELECTRICAL SPEC.,ESSENTRA / RICHCO,M.G. CHEMICAL,GC ELECTRONICS,VECTOR,SparkFun Electronics,ARIES ELECTRONICS,ChipQuikInc,SparkFunElectronics,AdafruitIndustries,MGChemicals,Olimex,BellinDynamic,Schmartboard,VectorElectronics&TechnologyInc,TWININDUSTRIES,ESSENTRACOMPONENTS,OSEPP,3MInterconnect,PHOENIXCONTACT,BUDIndustriesInc,Chemtronics,FEINMETALL,Efficient Power Conversion,Avnet Engineering Services,NXP SEMICONDUCTORS,M5Stack,SEEED/深圳矽递科技,GLOBAL SPECIALTIES,SEEED TECHNOLOGY,Red Pitaya,Arduino,TinyCircuits,TERASIC,SeeedDevelopmentLtd,PARALLAXINC,Pi Supply,PIMORONI,TEXAS INSTRUMENTS,UDOO,Digilent,NXPSemiconductors,TDKCorporation,BeagleBoard,PARALLAX,Parallax Inc,DigilentInc,AVNET,NTE,SequansCommunications,ROHM,MICROCHIP TECHNOLOGY,GAN SYSTEMS,onsemi,Lattice Semiconductor,WOLFSPEED,RENESAS,DIALOG SEMICONDUCTOR GMBH,SEMTECH CORPORATION,FTDI,Digi International,DISPLAY VISIONS,SEGGER,Microchip Technology/Atmel/Micrel,Analog Devices,Intel/Altera,Cologne Chip,Next Biometrics,Cypress Semiconductor/Spansion,TDK INVENSENSE,SILICON LABS,Makeblock,ON Semiconductor,BOURNS,On Semiconductor/Fairchild,Silicon Laboratories,TRINAMIC,INTEGRATED DEVICE TECHNOLOGY,Maxim,PHOENIX CONTACT,GigaDevice/北京兆易创新,GigaDevice,ARIES,MICROCHIP TECH.,BlackhawkDSP,Clairitec,AnalogDevicesInc,NewhavenDisplayInternational,Tinkerforge,TTElectronicsplc,SkyworksSolutionsInc,SEGGER MICROCONTROLLER,VishayIntertechnologies,Beagleboard.org,Linx,WIZNETCOLTD,SNOC,Xinabox,WIZNET,DLP Design,THATCorporation,NewAETechnologyInc,THINE ELECTRONICS,KEIL,TDK,MICRO CRYSTAL,AMPHENOL ADVANCED SENSORS,Particle,SAMTEC,Semikron,MARATHON/KULKA,FTDIChip,Lantronix,TexasInstruments,TianmaMicro-electronicsCo,ADLINK,KA-RO ELECTRONICS GMBH,Advantech,MULTICOMP PRO,NVIDIA,IWAVE SYSTEMS TECHNOLOGIES,Hammond Mfg.,OMRON,OMRON INDUSTRIAL,OPTO-22,EOS POWER,AdvantechCoLtd,KONTRON,AmphenolCorporation,IntelCorporation,LittelfuseInc,iEiIntegrationCorporation,krtkl,TechNexion,Wakefield-Vette,AAEONTechnologyInc,CROUZET,VIA Technologies,NXP SEMICONDUCTOR,Amphenol Aerospace,Moxa,AUVIDEA,ARROW ELECTRONICS,NEUTRIK,Murata Manufacturing,PANDUIT,Wandboard,Terabee,OMRONCorporation,FTDI CHIP,SCHNEIDER/施耐德,CamdenBoss,MURATA POWER SOLUTIONS,TE Connectivity / CoEv Magnetics Brand,Industruino,SchneiderElectric,LAIRDPLC,ABB,Advantech/台湾研华科技,Atmel,Crouzet Control,RASPBERRYPI,Knitter-Switch,Brady Worldwide Inc,Brother,Logitech,Lenovo,CHERRY,FUJITSU,RAISE3D,EUROSTAT,JABRA,Dymo,CERATECH,ULTIMAKER,Apem,FELLOWES,ROLINE,NEWLINK,HEWLETT PACKARD,Storm,EPSON,StarTech.com,LINDY ELECTRONICS,BRADY,ADDER,Visaton,Canon,BT,TOA,BCN3D,MOTOROLA,WASP,SEIKO INSTRUMENTS,Switchcraft,TRIPP LITE BY EATON,FUJITSU COMPONENTS,TE Connectivity / Raychem Brand,TE Connectivity / AMP Brand,TECONNECTIVITY,SeikoInstrumentsInc,TrippLite,SwitchcraftConxall,AltechCorporation,LINKSYS,MULTI-TECH SYSTEMS,Red Lion,MultiTech,KUNBUS,SIEMENS,SIEMENS/西门子,ZF,BRAINBOXES,D-Link,HARTING,DELTA PRODUCTS,HirschmannElectronicsGmbH&CoKg,Teltonika,HARTINGTechnologyGroup,Hirschmann,SIRETTA,Delta Electronics,ICP DAS USA,Ixxat,Amphenol,Altech,COTO Technology,HellermannTyton,EATON TRIPP LITE,WENGER,CONNECTIVE PERIPHERALS,Assmann WSW Components,BroadcomLimited,CONNECTIVEPERIPHERALSPTELTD,BRADY CORPORATION,NUVOTON TECHNOLOGY,BROADCOM,LITE-ON Technology/台湾光宝科技,Vishay Intertechnology,Isocom Components,Kingbright Electronic/台湾今台电子,Vishay,TOSHIBA,FAIRCHILD (ON SEMICONDUCTOR),VISHAY OPTO,Dialight,LITE-ON,LUMEX,BIVAR,LEDLENSER,Waldmann,Toshiba Semiconductor,Analog Devices Inc,Skyworks Solutions,Avago Technologies/Broadcom Limited,Skyworks Solutions Inc,Broadcom(博通),Vishay Semiconductors,NVE,FLUKE,Kyoritsu,Keysight Technologies,CEM/深圳华盛昌科技,Amprobe,Keithley,SCHUTZINGER,OHMITE,EXTECH,ECLIPSE TOOLS,SIMPSON ELECTRIC,BK PRECISION,B&KPrecisionCorporation,PomonaElectronics,Gossen Metrawatt,Chauvin Arnoux,Martindale,Metrix,Testo,Hirschmann Test & Measurement,Catu,Rohde & Schwarz,Schneider Electric,Mueller Electric,Keysight,VICTOR/西安胜利仪器,Siglent Technologies,UNI-T,B&K Precision,FLIR,GW Instek,JonardTools,KEITHLEYINSTRUMENTS,KeysightTechnologies,MENDA,Sanyo,Beha-Amprobe,VA LABs,POMONA,Wiha,Megger,Extech Instruments,TENMA,GREENLEE,POMONA ELECTRONICS,KLEIN TOOLS,MuellerElectricCompany,TeledyneLecroy,RIGOL/北京普源精电,TEKTRONIX,TEKTRONIX/泰克,TektronixInc,CALTESTELECTRONICS,Teledyne LeCroy,Pico Technology,CAL TEST ELECTRONICS,Testec,VELLEMAN,Lascar,MITUTOYO,MonoDAQ,Gemini,Efento,Eurotherm,Comark,Simex,Sifam Tinsley,Rotronic Instruments,Sefram,PicoTechnology,Socomec,Protimeter,Endress+Hauser,Calex,EATON,Anders Electronics,Pepperl + Fuchs,NI,HONEYWELL,Lumel,Contactum,Pyro Controle,Carlo Gavazzi,HOBUT,MURATA,CURTIS INSTRUMENTS,WIKA,SMC,Kern,BMI,Druck,Digitron,Kane,Adam Equipment Co Ltd,Festo,KIMO,Laserliner,DWYER INSTRUMENTS,FIGARO Engineering,Nidec Copal Electronics,Teledyne FLIR,TeledyneFLIR,AdvancedThermalSolutionsInc,SDT Ultrasound Solutions,Hanna Instruments,PeakTech,C.K TOOLS,NTE ELECTRONICS,Sauter,Testboy,HAKKO,SCS,Hirst Magnetics,Hanna,Georg Fischer,Christ Electronic Systems,Lovato,EA ELEKTRO-AUTOMATIK,Trumeter,TDK-LAMBDA,Veeder Root,TRUMETER COMPANY, INC,TRIPLETT CORP.,MurataManufacturingCoLtd,DanielsManufacturingCorporation(DMC),TDK-LAMBDACORPORATION,National Semiconductor,FAIRCHILD,Tempo,Cropico,Fluke Networks,HUBBELL,DESCO EUROPE,IDEAL INDUSTRIES INC,RRCpowersolutions,DINO-LITE,ESCHENBACH,Coil,Bresser,Luxo,Dinolite,Weller / Apex,Commscope,Metcal,Stuart,FLUKE CALIBRATION,Time Electronics,Brannan,Aoip Instrumentation,Carel,Eliwell,Bourdon,ELC,JUMO,Instruments Direct,CICOIL,NEUTRAL,SAUERMANN.,TM Electronics,Raytek}